As communications, computers and their peripheral products and household appliances continue to move toward high-frequency and digital, the miniaturization, integration, and modularization of components are becoming more and more urgent. It has been exaggerated to predict that the future electronics industry will be simplified into the assembly industry – assembling various functional modules together. LTCC (Low Temperature Co-fired Ceramics) will become the first choice for the integration and modularization of electronic devices in the future due to its excellent electrical, mechanical, thermal and process characteristics. It has developed rapidly in foreign countries and Taiwan Province of China, and has initially formed an industrial prototype. LTCC applications increasingly use LTCC to prepare chip passive integrated devices and modules have many advantages. First, ceramic materials have excellent high-frequency and high-Q characteristics. Second, the use of high-conductivity metal materials as conductor materials is beneficial to improve circuits. The quality factor of the system; third, it can adapt to the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary PCB circuit substrates; fourth, the passive components can be buried in the multilayer circuit substrate, which is beneficial to improve the circuit. Assembly density; fifth, with better temperature characteristics, such as a small thermal expansion coefficient, a small dielectric constant temperature coefficient, can make a very high number of circuit boards, can make a thin line structure with a line width of less than 50μm . In addition, the discontinuous production process allows the green substrate to be inspected, thereby increasing yield and reducing production costs. LTCC devices are generally classified into LTCC components, LTCC functional devices, LTCC package substrates, and LTCC module substrates according to the number of components they contain and their role in the circuit. Filters and duplexers in early communication products are mostly large dielectric filters and duplexers. Filters on GSM and CDMA handsets have now been replaced by acoustic surface filters or embedded in module substrates, while filters on PHS handsets and cordless phones are mostly small, inexpensive, LC filters made by LTCC. Bluetooth and wireless network cards use LC filters from the beginning. Filters made by LTCC include bandpass, highpass, and lowpass filters, with frequencies ranging from tens of MHz up to 5.8 GHz. LC filters have unparalleled advantages in terms of volume, price and temperature stability, and they are not difficult to understand as they continue to receive widespread attention. The above-mentioned RF devices produced by LTCC have been in foreign countries and Taiwan Province for several years. Japan's Murata, Dongguang, TDK, Shuangxin Motor, Taiwan's Huaxin Technology, ACX, South Korea's Samsung, etc. are in mass production. And sales. China’s mainland only saw in exhibitions and webpages in 2003 that CSG Electronics and another company started to develop similar products. The communication distance between the WLAN and the Bluetooth device is short, the transmission and reception power is small, and the power and transmission and reception characteristics of the antenna are not required, but the area and cost of the PCB occupied by the antenna are very strict. The chip antenna prepared by LTCC has the advantages of small size, convenient surface mounting, high reliability, low cost, and the like, and has been widely used for WLAN and Bluetooth. The modularization of electronic components has become an indisputable fact in the industry, with LTCC being the preferred method. The module substrates to choose from are LTCC, HTCC (High Temperature Co-fired Ceramics), and conventional PCBs such as FR4 and PTFE (High Performance Polytetrafluorohexene). The sintering temperature of HTCC is above 1500 °C, and the matching refractory metals such as tungsten, molybdenum/manganese have poor electrical conductivity, and the sintering shrinkage is not as easy to control as LTCC. The dielectric loss of LTCC is an order of magnitude lower than RF4. PTFE has lower loss but poor insulation. LTCC provides better control of accuracy than most organic substrate materials. No organic material can be compared to the high frequency performance, size and cost of the LTCC substrate. The research on LTCC module substrates in foreign countries and Taiwan Province in China is in full swing. There are many commercial production and application of LTCC modules. Only the mobile phone antenna switch module (ASM) is produced by Murata, Mitsubishi Electric, Kyocera, TDK, Epcos, Hitachi, Avx and so on. In addition, the Bluetooth modules of NEC, Murata and Ericsson, and the power amplifier modules of Hitachi and other companies are all made by the LTCC process. Due to its compact structure, mechanical shock resistance and thermal shock resistance, the LTCC module has received great attention and wide application in military and aerospace equipment. In the future, its application in automotive electronics will be very extensive. Localization has become an opportunity for the development of LTCC devices. The development of domestic LTCC devices is at least 5 years behind. This is mainly due to the lag in the development of electronic terminal products. LTCC functional devices and modules are mainly used for communication products such as GSM, CDMA and PHS mobile phones, cordless phones, WLAN and Bluetooth. In addition to more than 40 megabytes of cordless phones, these products have been developed in China for nearly five years. In order to seize the market as soon as possible, the original design of the domestic products was mostly bought from abroad, and even the package of components and components was purchased. The purchased products were all selected from foreign components. In the past few years, the main goal of the terminal product manufacturing plant was to expand market share, and the cost pressure was not large enough to take into account the localization of components. With the overcapacity of terminal products, the price and cost competition will become increasingly fierce, and the localization of components will be put on the agenda, which will provide a good market opportunity for the development of domestic LTCC devices. The development and production of LTCC devices must take into account the three aspects of materials, design and process and equipment. material The material properties of LTCC devices include electrical, thermomechanical and process performance. Power X (Qingdao) Energy Technology Co., Ltd. , https://www.solarpowerxx.com