After the PC era, smart phones are the driving force for semiconductor companies to climb to the peak. However, as mobile phone growth rates slow down, everyone is looking for the next growth engine. The Internet of Things is named the most, because the number of connections is very large. According to various statistics, the value of the Internet of Things is from tens of billions of dollars to more than one trillion dollars. After the smartphone, the Internet of Vehicles will become the driving force of semiconductor development In the past more than a month, there have been three high-profile mergers and acquisitions in the global semiconductor industry, namely Qualcomm and NXP, Siemens and Mentor Graphics, Samsung Electronics and Harman. The common keywords for these three mergers and acquisitions are: automotive electronics. The biggest growth thrust of the semiconductor industry in the next five years is not the Internet of Things, but the automotive electronics. The key is the content of siliconcontent. Although the Internet of Things application is huge, the silicon content is not high. In contrast, the silicon content of a car is very attractive. Looking at the mobile phone "car electronics" with the content of siliconcontent After the PC generation, smart phones are the driving force for semiconductor companies to climb to the peak. However, as the growth rate of mobile phones slows down, everyone is looking for the next growth engine. The Internet of Things is named the most, because the number of connections is very large. According to various statistics, the value of the Internet of Things is from tens of billions of dollars to more than one trillion dollars. The reason why smart phones can support the global semiconductor industry is because of the huge demand, plus enough connotation chips and saturated siliconcontent; global car shipments are not comparable to mobile phones, but a Tesla connotation of siliconcontent is a mobile phone. 5 to 10 times, but in contrast to the Internet of Things, its silicon content is very low. Worldwide, the annual shipment of smart phones is nearly 1.5 billion, which uses a variety of chips, and the core processor chips are built on the most advanced semiconductor processes, from 28 nm, 20 nm, 16/14. Nano, 10 nanometers, up to 7 nanometer process, with the amount of shipment plus the number of chips, and then calculate the effect of siliconcontent, it can be imagined that smart phones really hold up the semiconductor industry. However, in the era of the Internet of Things, although the number of connections is large, the silicon content is limited. With the most basic sensor, an 8-inch wafer can cut hundreds of thousands of sensor wafers, and the output value is not high. After conversion, it is possible to fill the entire IoT market without using a few 8-inch wafers. On the other hand, to produce the processor AP of the smart phone, a 12-inch wafer can only cut 400-600 quantities with the most advanced process, and the output value is extremely high. To meet the demand of 1.5 billion mobile phones worldwide, 12 is needed. The wafer production capacity is self-evident, which is why the mobile phone era is coming, and the semiconductor manufacturers have to expand production. Looking at the automotive industry, the traditional automotive industry does not use semiconductor chips, but with the changes in the entire automotive industry, a car's connotation of chips includes autopilot assistance systems, instrument panels, shock absorbers, exhaust systems, and car entertainment. System, vehicle-borne communication system, lane departure warning system, night vision system, road-based vehicle lamp system, parking assist system, vehicle anti-collision radar, etc., add up to hundreds of chips. Although the global annual car shipments are at most 90 million units, compared with smart phones, it is only a fraction of the time. However, the future electric vehicle industry is coming. From the perspective of siliconcontent, it is estimated that a silicon content of a Tesla connotation is a mobile phone. 5 to 10 times. In the past month, three high-profile mergers and acquisitions in the world have been aimed at the layout of automotive electronics. Qualcomm eats NXP Century and buys it as the king of automotive electronic chips Qualcomm recently acquired NXP, a European semiconductor chip company, for $47 billion, and acquired NXP's technologies and products in the automotive electronics, mixed-signal, microcontroller, and Netcom markets. The most critical of these is NXP's automotive-related chips. It should be the biggest incentive for Qualcomm to eat NXP. According to the analysis, Qualcomm's current product line relies heavily on mobile phone-related communication chips. It is estimated that mobile communication products account for more than 60% of revenue. With the addition of NXP's product line, the proportion of Qualcomm's mobile communication chips can be reduced to less than 50%. The proportion of revenue related to automotive electronics and the Internet of Things is nearly 30%. In fact, in 2015, NXP bought Freescale for $12 billion in order to strengthen the layout of automotive electronics, allowing NXP to sit on the world's largest electronic chip for car electronics. In the hands of Qualcomm, it is obvious that Qualcomm is optimistic about the next wave of growth momentum of the semiconductor industry in the future. It is from the automotive electronics and can be connected to the business of its communication chips. Siemens eats Mentor and looks like a sudden use of electronic business opportunities Coincidentally, another industry has broken the deal of glasses. It is the German industrial giant Siemens bought the EDA company MentorGraphics for $4.5 billion. The difference in the initial case of the acquisition is that the two companies are not directly The relevance of Siemens' acquisition of a company that does EDA tools is very surprising. MentorGraphics is one of the world's three largest EDA tools, second only to Synopsys and Cadence, providing a wide range of design, simulation and manufacturing tools for semiconductor chip and system development. Siemens is specialized in global electrical and electronic engineering, and its main business scope. Across the industry, medical, transportation equipment, etc., Siemens bought an EDA tool company to make the market very unexpected. However, due to technical and cost reasons, it is not widely used. In recent years, RFID technology has developed by leaps and bounds. With the development of large-scale integrated circuit and network communication technology, RFID technology has entered the commercial application field, and began to develop from the initial low frequency (125kHz) and high frequency (13.56mhz) to uHF (860 ~ 960MHz) and microwave. RFID technology has become one of the most promising information technologies in the new era because of its unique advantages showing great development potential and application space. In both low and high frequency bands, China has independently developed RFID chips in accordance with ISO14443 A, B and ISO15693 standards, which have been successfully applied in major projects such as city bus all-in-one card and second-generation resident ID card. However, in the uHF and microwave field, China started late, technology and products are still relatively short. In this context, this paper studies the design of 915MHz rf card reader. The system can be applied to vehicle monitoring, remote control, telemetry, access control system, identity identification, non-contact radio frequency smart card, wireless 485/232 data communication, safety and fire prevention and other fields. 915MHZ Rubber Antenna ,915MHZ Antenna with magnetic base ,915MHZ fiberglass antenna Yetnorson Antenna Co., Ltd. , https://www.yetnorson.com
After the PC era, smart phones were the driving force for semiconductor companies to climb to the peak. However, as mobile phone growth rates slowed down, everyone was looking for the next growth driver, and the Internet of Things was named the most.