Corning and the Soitec Group have announced a partnership agreement to develop a high-performance single-crystal silicon thin-film glass substrate (SiOG) technology for the next-generation flat-panel mobile display market. Since then, the two companies are committed to developing first-class quality backplane technology for organic light-emitting diode (OLED) mobile displays. The single crystal silicon film glass technology currently developed by Corning is a technology for attaching a single crystal silicon film to a display glass. Soitec's patented SmartCut(tm) technology transfers ultra-thin single-crystal silicon layers of wafer substrate materials to other surfaces. This technology has been widely used in the packaging production of more than 90% of silicon-on-insulator (SOI) wafers worldwide.

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